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SHINHOP laser

Casting Extreme Welding Process & Intelligent Laser Application Scheme

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Laser Cutting Machine for Circuit Boards
Laser Cutting Machine for Circuit Boards
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  • Description
  • The SHINHOPPCB laser cutting machine is a laser processing system designed for circuit board cutting, featuring CCD precision positioning that automatically corrects the cutting path. The high-precision motion mechanism enhances the stability and precision of processing, significantly improving yield rates, and perfectly achieving contour cutting, drilling, FPC, PCB shape cutting, and ultra-precision processing applications for composite film window openings.
    The 20W high-power laser efficiently cuts various products such as FPC, PCB, and rigid-flex boards with just the product design drawings, eliminating the need for molds to cut any shape, greatly shortening production cycles and freeing up HR. The combination of high-precision, low-drift galvanometer and servo system platform provides excellent micron-level cutting precision. The stress-free cutting mode, combined with the fully automatic CCD positioning system, delivers perfect cutting results. The green and environmentally friendly cutting process effectively avoids harm to operators and pollution to the environment.
     
    ● Traditional cutting machines are prone to delamination and burrs, requiring molds for small batch production, which is time-consuming and expensive for high-precision molds. This machine does not require molds and can form in one go.
    ● Can shorten positioning time and save a lot of labor costs.
    ● Through CCD precision positioning, the computer can automatically capture the positioning rake before cutting begins and perform relative positioning comparisons to correct the cutting path.
    High-quality stable cutting design:  
    ● Can perform upper and lower suction actions.
    ● User-friendly control program, can replicate the number and spacing of cutting patterns, saving a lot of drawing time.
    ● Uses a vacuum adsorption platform.
    ● Excellent suction efficiency, no need to worry about smoke and dust pollution.
    ● Special program design improves processing efficiency and quality.
    ● Good edge cutting effect, uniform cutting seams, stable power, no significant issues with cutting points.
    High-precision motion mechanism:
    ● Uses high-precision servo motors and lead screws to ensure processing stability and precision, minimizing defect rates.
    ● The special mechanism design of this machine allows for high-efficiency cutting, with fast, smooth, and repeatable performance.
     
    Technical parameters
    Wavelength: 532nm
    Minimum processing line width: <50 μm
    Platform Size: 320mm*420mm/620mm*620mm
    Positioning accuracy: ≤ ±3 μm
    Repeat accuracy: ≤ ±1 μm
    Processing accuracy: ≤ ±20 μm
    Platform moving speed: ≤300mm/s
    Scanning processing speed: ≤3000mm/s
    Processing thickness: ≤1mm
    Weight: 850KG/3000KG
    Machine dimensions: L1300*W1100*H1700mm/ L2250*W2500*H1700mm
     

Laser Cutting Machine for Circuit Boards

The SHINHOPPCB circuit board laser cutting machine is a laser processing system designed for circuit board cutting, featuring CCD precision positioning that automatically corrects the cutting path. The high-precision motion mechanism enhances the stability and precision of the processing, significantly improving the yield rate. It perfectly achieves contour cutting, drilling, FPC, PCB shape cutting, and ultra-precision processing applications for composite film window openings.

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Factory View

A scientific and technological enterprise specializing in the research and development, production and sales of industrial laser processing equipment, has been deeply engaged in the new energy industry for 20 years, focusing on the non-standard customization of automatic lithium battery cell assembly line and module PACK production line, and has successively obtained the national high-tech and specialized new enterprise certification.

MES & Smart Storage Division
PACK Production Division
Cell Assembly Division
Optical Laser Machine Division
Precision Machinery Division
R&D Center

FAQ

Q1: What is the training duration?

A: Our 3-5 day intensive program with operation manuals ensures independent operation capability.

Q2: What after-sales support is included?

A: Lifetime unlimited technical support directly from our engineering team.

Q3: Do you provide training for other brands' equipment?

A: Training services are exclusively available for SHINHOP laser systems.

Q4: How are training sessions arranged?

A: We offer completely customized training schedules based on your production plan.

Q5: Are processing solutions included?

A: Yes, including complete technical documentation and industry-specific parameter databases.

Q6: What are the training fees?

A: - Free remote guidance services - On-site training requires covering engineers' travel expenses

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Online Inquiry

We will contact you within one working day.

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